Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
Contributor(s): Bailey, Christopher | Liu, Johan | ebrary, Inc
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Series: Soldering & surface mount technology ; v.18, no. 2.Publisher: Bradford, England : Emerald Group Pub, c2006Description: 72 p.Subject(s): Manufacturing processes | Electronic packagingGenre/Form: Electronic books.Online resources: An electronic book accessible through the World Wide Web; click to view
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Electronic reproduction. Palo Alto, Calif. : ebrary, 2009. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.