Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
By: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
Contributor(s): ebrary, Inc
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Publisher: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990Description: xiv, 139 p. : ill.Subject(s): Electronic packaging -- Materials | Electrical engineering -- MaterialsGenre/Form: Electronic books.DDC classification: 621.381/046 Online resources: An electronic book accessible through the World Wide Web; click to view
| Item type | Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
| 621.381/046 (Browse shelf) | Available |
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"NMAB-449."
Includes bibliographical references.
TSLHHL
Electronic reproduction. Palo Alto, Calif. : ebrary, 2009. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.