Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging  [electronic resource] / 
guest editors Christopher Bailey and Johan Liu. 
 - Bradford, England :  Emerald Group Pub,  c2006. 
 - 72 p. 
 - Soldering & surface mount technology ;  v.18, no. 2 .
<br/><br/><br/>Electronic reproduction. <br/>Palo Alto, Calif. : <br/>ebrary, <br/>2009. <br/>Available via World Wide Web. <br/>Access may be limited to ebrary affiliated libraries. 
<br/><br/><label>ISBN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Manufacturing processes.<br/>Electronic packaging.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .A48 2006eb