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Heat transfer : thermal management of electronics / Younes Shabany.
by Shabany, Younes. Publisher: Boca Raton : CRC Press, c2010Availability: Items available for loan: Taylor's Library-TU
[Call number: 621.381 SHA 2010]
(1).
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Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
by National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging | ebrary, Inc. Publisher: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan:
[Call number: 621.381/046]
(1).
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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
by Bailey, Christopher | Liu, Johan | ebrary, Inc. Publisher: Bradford, England : Emerald Group Pub, c2006Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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Reliability of power electronic converter systems [electronic resource] / Chung, Blaabjerg, Wang & Pecht (eds.) hwa@et.aau.dk; fbl@et.aau.dk; eeshc@cityu.edu.hk; pecht@calce.umd.edu.
by Chung, Henry Shu-hung | Wang, Huai | Blaabjerg, Frede | Pecht, Michael. Publisher: Stevenage : IET, 2015Online access: An electronic book accessible through the World Wide Web; click to view Availability: No items available
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IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging [electronic resource] : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society.
by Institute of Electrical and Electronics Engineers | Lasers and Electro-optics Society (Institute of Electrical and Electronics Engineers) | Components, Packaging & Manufacturing Technology Society. Source: Academic Source CompletePublisher: New York, NY : Institute of Electrical and Electronics Engineers, c1994-c1998Other title: Transactions on components, packaging, and manufacturing technology. | Advanced packaging | Components, packaging, and manufacturing technology.Online access: Abstracts Available: Aug 1996-Nov 1998 Available on EBSCOhost. Availability: No items available
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Microelectronics international [electronic resource] : journal of ISHM--Europe, the Microelectronics Society--Europe.
by International Society for Hybrid Microelectronics Europe | International Microelectronics and Packaging Society. Source: Academic Source CompletePublisher: Isle of Man : Wela Publications, c1995-Online access: Abstracts Available: Jan 2007- Available on EBSCOhost. Availability: No items available
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IEEE transactions on advanced packaging [electronic resource] a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society.
by Components, Packaging & Manufacturing Technology Society | Lasers and Electro-optics Society (Institute of Electrical and Electronics Engineers) | Institute of Electrical and Electronics Engineers. Source: Academic Source CompletePublisher: Piscataway, NJ : Institute of Electrical and Electronics Engineers, 1999-Other title: Transactions on advanced packaging | Advanced packaging | Institute of Electrical and Electronics Engineers transactions on advanced packaging.Online access: Abstracts Available: Feb 1999- Available on EBSCOhost. Availability: No items available
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Boundary-scan interconnect diagnosis [electronic resource] / José T. de Sousa, Peter Y.K. Cheung.
by Sousa, Jose T. de | Cheung, Peter Y. K | ebrary, Inc. Publisher: Boston : Kluwer Academic Publishers, c2001Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan:
[Call number: 621.381]
(1).
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LED packaging for lighting applications [electronic resource] : design, manufacturing, and testing / Sheng Liu, Xiaobing Luo.
by Liu, S. (Sheng), 1963- | Luo, Xiaobing, 1974- | Chemical Industry Press | ebrary, Inc. Publisher: Hoboken, N.J. : Wiley, 2011Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for loan:
[Call number: 621.3815/22]
(1).
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Rf and microwave module level design and integration/ Mohammad Almalkawi.
by Almalkawi, Mohammad. Publisher: Stevenage : IET, 2019Online access: An electronic book accessible through the World Wide Web; click to view Availability: Items available for reference: Taylor's Library - Perpetual(TU) (1).
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